• DocumentCode
    1953707
  • Title

    Study of atmosphere influence on BGA solder balls process

  • Author

    Otahal, A. ; Szendiuch, I.

  • Author_Institution
    Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
  • fYear
    2013
  • fDate
    8-12 May 2013
  • Firstpage
    146
  • Lastpage
    151
  • Abstract
    This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.
  • Keywords
    ball grid arrays; copper alloys; lead alloys; shear strength; silver alloys; solders; tin alloys; BGA solder ball process; Sn63Pb37; SnAgCu; atmosphere influence; mechanical parameters; nitrogen concentration; shear strength; Atmosphere; Atmospheric measurements; Copper; Lead; Nitrogen; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2013 36th International Spring Seminar on
  • Conference_Location
    Alba Iulia
  • ISSN
    2161-2528
  • Type

    conf

  • DOI
    10.1109/ISSE.2013.6648232
  • Filename
    6648232
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1953707