DocumentCode :
1953707
Title :
Study of atmosphere influence on BGA solder balls process
Author :
Otahal, A. ; Szendiuch, I.
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
fYear :
2013
fDate :
8-12 May 2013
Firstpage :
146
Lastpage :
151
Abstract :
This article deals with the influence of different atmosphere (normal, vapor, nitrogen) on some mechanical parameters, as shear strength, for BGA solder balls (Sn63Pb37, SAC305). There are also micro-sections of solder balls studied. Main objective of this work is to establish the optimal and necessary concentration of nitrogen for each application.
Keywords :
ball grid arrays; copper alloys; lead alloys; shear strength; silver alloys; solders; tin alloys; BGA solder ball process; Sn63Pb37; SnAgCu; atmosphere influence; mechanical parameters; nitrogen concentration; shear strength; Atmosphere; Atmospheric measurements; Copper; Lead; Nitrogen; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
ISSN :
2161-2528
Type :
conf
DOI :
10.1109/ISSE.2013.6648232
Filename :
6648232
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1953707
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