DocumentCode :
1953709
Title :
A Study of Transient Temperature Measuring System Based on LabVIEW for Droplets
Author :
Lin, X.M. ; Zhao, Z.Y.
Author_Institution :
Dept. of Mech. Eng. & Autom., Univ. of HuaQiao, Quanzhou
Volume :
2
fYear :
2008
fDate :
12-14 Dec. 2008
Firstpage :
476
Lastpage :
480
Abstract :
During the material accumulation process derived from the deposit of molten particles after impacting, flattening, cooling and solidification, the transient temperature variation directly affects splatting behaviors and forming quality. The transient temperature history of splatting process has received considerable attention in this field. LabVIEW by National Instruments is a user friendly and powerful graphical development environment for signal acquisition, measurement analysis, and data presentation. In this paper, a temperature acquisition and measuring system based on a fast-response thermocouple is designed under LabVIEW software platform. In addition, a digital method is used to compensate for the cold junction temperature and calibrate the nonlinearity between the output signal and the temperature obtained by the thermocouple. The measurement of Sn-Pb droplet splatting transient temperature indicates that the system is of low cost, high accuracy, simple operation, visual interface, etc., and the system can also be used widely for other transient high temperature measurement.
Keywords :
computerised instrumentation; cooling; drops; solidification; temperature measurement; thermocouples; LabVIEW software platform; Sn-Pb droplet splatting transient temperature; cold junction temperature; cooling; data presentation; droplets; fast-response thermocouple; flattening; forming quality; graphical development environment; high temperature measurement; impacting; material accumulation process; measurement analysis; molten particles; signal acquisition; solidification; splatting behavior; splatting process; temperature acquisition; transient temperature history; transient temperature measuring system; transient temperature variation; Coatings; Cooling; Instruments; Plasma measurements; Plasma temperature; Residual stresses; Software measurement; Substrates; Temperature measurement; Thermal spraying; droplet splatting; fast-response thermocouple; labview; transient temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Science and Software Engineering, 2008 International Conference on
Conference_Location :
Wuhan, Hubei
Print_ISBN :
978-0-7695-3336-0
Type :
conf
DOI :
10.1109/CSSE.2008.653
Filename :
4722097
Link To Document :
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