• DocumentCode
    1953709
  • Title

    A Study of Transient Temperature Measuring System Based on LabVIEW for Droplets

  • Author

    Lin, X.M. ; Zhao, Z.Y.

  • Author_Institution
    Dept. of Mech. Eng. & Autom., Univ. of HuaQiao, Quanzhou
  • Volume
    2
  • fYear
    2008
  • fDate
    12-14 Dec. 2008
  • Firstpage
    476
  • Lastpage
    480
  • Abstract
    During the material accumulation process derived from the deposit of molten particles after impacting, flattening, cooling and solidification, the transient temperature variation directly affects splatting behaviors and forming quality. The transient temperature history of splatting process has received considerable attention in this field. LabVIEW by National Instruments is a user friendly and powerful graphical development environment for signal acquisition, measurement analysis, and data presentation. In this paper, a temperature acquisition and measuring system based on a fast-response thermocouple is designed under LabVIEW software platform. In addition, a digital method is used to compensate for the cold junction temperature and calibrate the nonlinearity between the output signal and the temperature obtained by the thermocouple. The measurement of Sn-Pb droplet splatting transient temperature indicates that the system is of low cost, high accuracy, simple operation, visual interface, etc., and the system can also be used widely for other transient high temperature measurement.
  • Keywords
    computerised instrumentation; cooling; drops; solidification; temperature measurement; thermocouples; LabVIEW software platform; Sn-Pb droplet splatting transient temperature; cold junction temperature; cooling; data presentation; droplets; fast-response thermocouple; flattening; forming quality; graphical development environment; high temperature measurement; impacting; material accumulation process; measurement analysis; molten particles; signal acquisition; solidification; splatting behavior; splatting process; temperature acquisition; transient temperature history; transient temperature measuring system; transient temperature variation; Coatings; Cooling; Instruments; Plasma measurements; Plasma temperature; Residual stresses; Software measurement; Substrates; Temperature measurement; Thermal spraying; droplet splatting; fast-response thermocouple; labview; transient temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Software Engineering, 2008 International Conference on
  • Conference_Location
    Wuhan, Hubei
  • Print_ISBN
    978-0-7695-3336-0
  • Type

    conf

  • DOI
    10.1109/CSSE.2008.653
  • Filename
    4722097