Cohesive zone model for delamination analysis of an embedded die system in package

Author

Li, Xiaopei ; Gu, Jianghai ; Xu, Yangjian ; Liu, Yong

Author_Institution

Fairchild-ZJUT Microelectron. Packaging Joint Lab., Zhejiang Univ. of Technol., Hangzhou, China

fYear

2012

fDate

16-18 April 2012

Firstpage

42379

Lastpage

42653

Abstract

Thermal mismatch induces interfacial delamination between die and die attach in embedded die package has been studied with a bilinear cohesive zone model. One die, two dies, three dies are considered in the embedded die system in package (SiP). A damage parameter is introduced to describe the interfacial failure. The location of delimination and interfacial damage evolution is investigated. The effects with different parameters such as epoxy resin Young´s modulus and CZM shear strength are studied finally.

Keywords

Young´s modulus; delamination; embedded systems; resins; system-in-package; CZM shear strength; bilinear cohesive zone model; delamination analysis; die attach; embedded die system in package; epoxy resin Young´s modulus; interfacial damage evolution; interfacial delamination; interfacial failure; thermal mismatch; Epoxy resins; Lead; Cohesive zone model; Delamination; Embedded die SiP;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on

Conference_Location

Cascais

Print_ISBN

978-1-4673-1512-8

Type

conf

DOI

10.1109/ESimE.2012.6191787

Filename

6191787