DocumentCode
1953746
Title
Air-coupled ultrasound wave propagation in glued laminated timber structures applied to bonding quality assessment
Author
Sanabria, S.J. ; Furrer, R. ; Neuenschwander, J. ; Niemz, P. ; Sennhauser, U.
Author_Institution
Electron./Metrol./Reliability Lab., Empa (Swiss Fed. Labs. for Mater. Sci. & Technol.), Dubendorf, Switzerland
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1466
Lastpage
1469
Abstract
Non-destructive assessment of glulam laminations is necessary in order to prevent security hazards. Air-coupled ultrasound (ACU) is sensitive to delamination, reproducible and allows for high scanning resolution. In this work we developed a novel ACU imaging system in normal transmission for inspection of up to 280 mm high glulam. The coupling and propagation of ACU waves in glulam were investigated with plane wave theory applied to an orthotropic model of wood as a function of grain and ring angles. Finite Difference Time Domain (FDTD) simulations were also carried out. The systematic amplitude heterogeneity in defect-free regions was linked to energy flux shifts and mode conversion phenomena, and compensated for in the images. Specific amplitude tracking and difference imaging algorithms allowed successful imaging of bonding and saw cut defects.
Keywords
delamination; finite difference time-domain analysis; laminations; timber; ultrasonic imaging; ultrasonic materials testing; ultrasonic propagation; wood products; ACU imaging system algorithms; FDTD; air-coupled ultrasound wave propagation; bonding quality assessment; energy flux shifts; finite difference time domain simulations; glued laminated timber structures; glulam delaminations; grain angle; mode conversion phenomena; nondestructive testing; orthotropic wood model; plane wave theory; ring angle; saw cut defects; specific amplitude tracking; systematic amplitude heterogeneity; Acoustics; Analytical models; Couplings; Imaging; Reflection; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935552
Filename
5935552
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