DocumentCode :
1953884
Title :
Determination of interface fracture parameters by shear testing using different theoretical approaches
Author :
Dudek, R. ; Brämer, B. ; Auersperg, J. ; Pufall, R. ; Walter, H. ; Seiler, B. ; Wunderle, B.
Author_Institution :
Micro Mater. Center Chemnitz, Fraunhofer ENAS, Chemnitz, Germany
fYear :
2012
fDate :
16-18 April 2012
Firstpage :
42379
Lastpage :
42653
Abstract :
Simple adhesion tests like the pull-out test or the button shear tests have been used in industry for decades. They offer a great potential for comparison of different molding compounds, encapsulants, or adhesives on different types of sub-strates with or without surface treatment. However, for theoretical prediction purposes, interface fracture mechanics parameters are needed. Quantitative evaluations of the test applied to molding compound (MC)-button on Cu-leadframe by different fracture- and damage mechanical approaches are the subjects of the paper. Defect tolerant methodologies like the “virtual crack closure technique” (VCCT), which consider the interface initially delaminated, are compared to the damage methodology “cohesive zone modelling (CZM)”, which needs no initial crack and can track the delamination progress. Calculated fracture parameters, in particular the energy release rates and mode mixity are compared. Effects on these parameters are discussed for different button shapes. In-situ tracking of delamination progress for a cubic button is shown using the optical correlation technique microDAC.
Keywords :
cracks; delamination; fracture; fracture mechanics; adhesives; button shear test; cohesive zone modelling; cubic button; defect tolerant methodology; delamination progress; encapsulants; initial crack; interface fracture mechanics; interface fracture parameter; mode mixity; molding compound; optical correlation technique microDAC; pull-out test; shear testing; simple adhesion test; substrates; surface treatment; virtual crack closure technique; Creep; Integrated optics; Lead;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
Type :
conf
DOI :
10.1109/ESimE.2012.6191793
Filename :
6191793
Link To Document :
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