Usage of LTCC technology in electronic packaging

Low Temperature Co-fired Ceramics (LTCC) is very progressive technology, which finds utilization in a couple of applications deal with new microelectronic structures and configurations. Contributing application is also electronic package, where LTCC offers many possibilities, such as realization of 3D structures, embedded components, etc. In this paper the main aim is focused on usage of this technology for design and development of new electronics package, which should be cheap and easy for manufacturing. Such type of package will be very useful either for research laboratories and test vehicles or for simple electronic circuits, which needs to be attached to the electronics system through the package.