Title :
Thermal-mechanical responses of 3D IC integration with a passive TSV interposer
Author :
Lau, John H. ; Wu, Shang-Tsai ; Chien, Heng-Chieh
Author_Institution :
Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan
Abstract :
In this study, 3D IC integrations with a TSV interposer supporting Moore´s law chips on its top and bottom sides are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the Cu-low-k pads and micro solder joints.
Keywords :
solders; three-dimensional integrated circuits; 3D IC integration; Moore law chips; creep strain; micro solder joint; nonlinear stress; passive TSV interposer warpage; thermal-mechanical response; Copper; Heating; Random access memory; Silicon; Substrates; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191797
