Title :
Finite element modeling of solder joint fatigue in four-point bending test
Author :
Sabuncuoglu, Baris ; Vanhee, Filip ; Willems, Geert ; Vandevelde, Bart ; Vandepitte, Dirk ; De Wolf, Ingrid
Author_Institution :
Imec, Leuven, Belgium
Abstract :
In this study, the fatigue performance of solder joints in four point bending test was evaluated by a novel finite-element modeling method. A simplified modeling technique was implemented in order to focus on the behavior of the critical solder joint. The fatigue life was estimated by taking into account the creep behavior of solder joints. Morrow´s fatigue model was utilized to determine the fatigue life. The results were compared with the ongoing test results. Some additional studies were performed in order to observe the reliability of the modeling method and the effect test parameters.
Keywords :
bending; creep; fatigue testing; finite element analysis; life testing; solders; creep behavior; critical solder joint; fatigue life; fatigue model; fatigue performance; finite element modeling; finite-element modeling method; four-point bending test; modeling technique; solder joint fatigue; test parameters; Computational modeling; Equations; Fatigue; Joints; Load modeling; Mathematical model; Strain;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191801
