Title :
Vertical interconnection for flip chip connection
Author :
Rudnicki, Janusz ; Starski, J. Piotr
Author_Institution :
Instytut Radioelektroniki Politechniki Warszawskiej, Warszawa, Poland
Abstract :
In this paper we present computer simulations for vertical interconnections between a CPW transmission line and a CPW chip (CPW-CPW) using isotropic (ICA) and anisotropic (ACA) conductive adhesives. The location of the bumps in both types of adhesives is investigated for both interconnection types. Another structure is CPW-MS transition in which the active surface is turned upwards from the CPW board. The design of the circuit in this case is greatly facilitated - this configuration only needs one via-hole for each connection.
Keywords :
MMIC; adhesives; chip scale packaging; coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; microassembling; technology CAD (electronics); thermal management (packaging); 3D FDTD computer simulator; ACA; CPW board; CPW chip; CPW transmission line; CPW-CPW; CPW-MS transition; ICA; MMIC; adhesive bump location; anisotropic conductive adhesives; connection via holes; coplanar waveguides; flip chip bump thermal resistance; flip chip vertical interconnections; isotropic conductive adhesives; upwardly turned active surface; Anisotropic magnetoresistance; Conductive adhesives; Coplanar waveguides; Microwave technology; Reflection;
Conference_Titel :
Microwaves, Radar and Wireless Communications, 2002. MIKON-2002. 14th International Conference on
Print_ISBN :
83-906662-5-1
DOI :
10.1109/MIKON.2002.1017966
