Vertical interconnection for flip chip connection

Author

Rudnicki, Janusz ; Starski, J. Piotr

Author_Institution

Instytut Radioelektroniki Politechniki Warszawskiej, Warszawa, Poland

Volume

3

fYear

2002

fDate

2002

Firstpage

829

Abstract

In this paper we present computer simulations for vertical interconnections between a CPW transmission line and a CPW chip (CPW-CPW) using isotropic (ICA) and anisotropic (ACA) conductive adhesives. The location of the bumps in both types of adhesives is investigated for both interconnection types. Another structure is CPW-MS transition in which the active surface is turned upwards from the CPW board. The design of the circuit in this case is greatly facilitated - this configuration only needs one via-hole for each connection.

Keywords

MMIC; adhesives; chip scale packaging; coplanar waveguides; finite difference time-domain analysis; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; microassembling; technology CAD (electronics); thermal management (packaging); 3D FDTD computer simulator; ACA; CPW board; CPW chip; CPW transmission line; CPW-CPW; CPW-MS transition; ICA; MMIC; adhesive bump location; anisotropic conductive adhesives; connection via holes; coplanar waveguides; flip chip bump thermal resistance; flip chip vertical interconnections; isotropic conductive adhesives; upwardly turned active surface; Anisotropic magnetoresistance; Conductive adhesives; Coplanar waveguides; Microwave technology; Reflection;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Radar and Wireless Communications, 2002. MIKON-2002. 14th International Conference on

Print_ISBN

83-906662-5-1

Type

conf

DOI

10.1109/MIKON.2002.1017966

Filename

1017966