DocumentCode
1955690
Title
Ovenized and thermally tunable aluminum nitride microresonators
Author
Kim, Bongsang ; Olsson, Roy H., III ; Wojciechowski, Kenneth E.
Author_Institution
Adv. MEMS Dept., Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
974
Lastpage
978
Abstract
Frequency tuning of aluminum nitride (AlN) microresonators has been demonstrated via localized heating (ovenization) of the resonator. Specifically, piezoelectrically driven 625 MHz microresonators were heated by embedded joule heaters in vacuum. A temperature increase of 135°C was achieved with only 2.8 mW of power consumption. This increase corresponds to ~4500ppm of frequency shift. To minimize heat loss, the devices were suspended from the substrate by high thermal isolation beam type supports. The beams exhibit very high thermal resistance, not only due to their high length to cross-sectional area ratio, but also because they are made of thin-film deposited polycrystalline aluminum nitride. Thin AlN films have been shown to have thermal conductivities that are much lower than that measured in bulk materials. The availability of a power efficient frequency tuning method in aluminum nitride microresonators enables low power ovenization of AlN MEMS-based timing devices and tunable filtering for communication systems.
Keywords
aluminium compounds; microcavities; micromechanical resonators; thermal conductivity; thin films; tuning; AlN; MEMS-based timing devices; aluminum nitride microresonators; embedded joule heaters; frequency 625 MHz; frequency tuning; localized heating; ovenization; polycrystalline aluminum nitride; power 2.8 mW; thermal conductivity; thermal isolation beam; thermal resistance; thermally tunable microresonators; thin film; tunable filtering; Aluminum nitride; Electrical resistance measurement; Electrodes; Heating; Integrated circuit modeling; Resonant frequency; Temperature measurement; aluminum nitride resonator; frequency tuning; oven-based tuning; ovenization; thermal model;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935635
Filename
5935635
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