DocumentCode :
1955691
Title :
Ultra-high charge storage capacity ferroelectric lead zirconate titanate thin films for gigabit-scale DRAM´s
Author :
Moazzami, R. ; Maniar, P.D. ; Jones, R.E., Jr. ; Campbell, A.C. ; Mogab, C.J.
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
fYear :
1992
fDate :
13-16 Dec. 1992
Firstpage :
973
Lastpage :
975
Abstract :
This paper describes an investigation of thickness scaling of sol gel-derived ferroelectric lead zirconate titanate (PZT) thin films that demonstrates the highest charge storage capacity (220 fC/ mu m/sup 2/ for a 1.5 V voltage swing) ever reported, low leakage current density (<10-7 A/cm/sup 2/ at 0.75 V for V/sub DD//2 operation), and good dielectric integrity. V/sub DD//2 operation is also shown to be viable with these ferroelectric films since no fatigue is observed after 10/sup 11/ polarization reversals. These PZT films hold promise as an alternative to the conventional trench and stacked capacitor cell technologies employing SiO/sub 2//Si/sub 3/N/sub 4/ dielectrics which demand extremely severe geometries and exceedingly complex processes to meet the charge storage specifications of gigabit-scale DRAM´s.<>
Keywords :
DRAM chips; dielectric hysteresis; dielectric polarisation; ferroelectric storage; ferroelectric thin films; lead compounds; leakage currents; 0.75 to 3 V; 1000 A; 700 to 3000 A; PZT; PbZrO3TiO3; dielectric integrity; ferroelectric PZT thin films; gigabit-scale DRAMs; low leakage current density; polarization reversals; sol gel-derived films; ultrahigh charge storage capacity; DRAM chips; Dielectric hysteresis; Dielectric polarization; Ferroelectric films; Ferroelectric memories; Lead compounds; Leakage currents;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1992.307519
Filename :
307519
Link To Document :
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