• DocumentCode
    1955866
  • Title

    Nanoscale welding by AFM tip induced electric field

  • Author

    Yu, Haibo ; Jiao, Niandong ; Dong, Zaili ; Qu, Yanli ; Li, Wen J. ; Wang, Yuechao

  • Author_Institution
    Robot. Lab., Chinese Acad. of Sci., Shenyang
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    116
  • Lastpage
    120
  • Abstract
    The most difficult challenges in fabricating SWCNT-based nanosystems or nanodevices have proven to be the assembly and anchoring of SWCNTs to form a stable physical and electric contact between SWCNTs and the electrodes. For example, for SWCNT-based nanosensors or field effect transistors (FETs), the need to fix the SWCNT between electrodes is extremely important, i.e., it affects the electronic transport properties at the connection point. Currently, researchers usually focus on the assembly between SWCNTs and the electrodes by using dielectrophoresis (DEP), direct growth, or atomic force microscopy (AFM). In this paper, we present a new method to realize nanoscale welding by using an AFM tip coated with conductive materials. This method is very useful in welding the SWCNTs on the microelectrodes after the manipulation of the SWCNTs in between the microelectrodes by AFM-based or DEP-based manipulation. In our experiments, we first assembled individual SWCNTs or bundles of SWCNTs between two electrodes using DEP force. Then, SWCNTs are welded on the surface of the electrodes when a bias impulse voltage is exerted between the AFM tip and sample, which produces an electric field. The experimental results have demonstrated that SWCNTs can effectively be welded on the surface of the electrodes.
  • Keywords
    atomic force microscopy; carbon nanotubes; electrophoresis; nanotechnology; welding; AFM tip; C; DEP-based manipulation; SWCNT bundles; conductive materials; dielectrophoresis; electrode surface; microelectrodes; nanoscale welding; single-walled carbon nanotubes; Assembly; Atomic force microscopy; Electrodes; FETs; Laboratories; Mechanical factors; Semiconductivity; Systems engineering and theory; Voltage; Welding; AFM; DEP; Nano-welding; Nanodevices; SWCNTs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068539
  • Filename
    5068539