FEM analysis of flip-chip type BGA

Author

Sakurai, Masaya ; Shibuya, Hitoshi ; Utsunomya, J.

Author_Institution

Integrated Designing Div., Oki Electr. Ind. Co. Ltd., Saitama, Japan

fYear

1998

fDate

27-29 Apr 1998

Firstpage

131

Lastpage

136

Abstract

A three-dimensional FEM (finite element method) analysis was performed on a flip-chip type BGA (ball grid array), and the resulting maximum equivalent plastic strain range (MEPSR) was used to determine the optimum material and structure for such packages. As a result, we were able to confirm the substantial influence of the combination of various materials, and structural parameters upon the package thermal fatigue life, and its nature. This also allowed us to optimize the material elements, an important parameter in package design, and the package structure

Keywords

ball grid arrays; circuit analysis computing; circuit optimisation; finite element analysis; flip-chip devices; integrated circuit modelling; integrated circuit packaging; plastic deformation; thermal stress cracking; 3D finite element method analysis; FEM analysis; flip-chip type BGA; flip-chip type ball grid array; material elements optimization; maximum equivalent plastic strain range; optimum package material; optimum package structure; package design; package structure optimization; package thermal fatigue life; structural parameters; Capacitive sensors; Electronic packaging thermal management; Fatigue; Performance analysis; Plastic packaging; Plastics industry; Resins; Thermal expansion; Thermal loading; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International

Conference_Location

Berlin

Print_ISBN

0-7803-4520-7

Type

conf

DOI

10.1109/IEMTE.1998.723074

Filename

723074