DocumentCode
1956053
Title
Reliability of laser diode modules in temperature-uncontrolled environment
Author
Ciappa, Mauro ; Malberti, Paolo
Author_Institution
Reliability Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
fYear
1994
fDate
11-14 April 1994
Firstpage
466
Lastpage
469
Abstract
An extensive thermal-cycling program of InP laser diode modules, in cylindrical package with fiber pig-tail, from two different manufacturers has been performed in order to evaluate their reliability. Experimental results are presented, the main failure mechanisms are identified, and a simple life-time model is proposed. Using this model, the number of cycles to failure under different thermal stress conditions may be computed.<>
Keywords
III-V semiconductors; indium compounds; life testing; reliability; semiconductor lasers; thermal stresses; InP; cylindrical package; failure mechanisms; fiber pig-tail; laser diode modules; life-time model; reliability; temperature-uncontrolled environment; thermal stress conditions; thermal-cycling program; Diode lasers; Electronic packaging thermal management; Failure analysis; Lenses; Manufacturing; Silicon; Temperature; Testing; Thermal stresses; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location
San Jose, CA, USA
Print_ISBN
0-7803-1357-7
Type
conf
DOI
10.1109/RELPHY.1994.307798
Filename
307798
Link To Document