Title :
Electro-thermal circuit simulation of analog controlled power circuitry
Author :
Digele, G. ; Lindenkreuz, S. ; Kasper, E.
Author_Institution :
Robert Bosch GmbH, Reutlingen, Germany
Abstract :
We present circuit simulation by considering self-heating of and electro-thermal interaction between the devices. The heat diffusion equation is solved in the silicon die, adhesive layer and header. Thermal compact models represent heat propagation through power packages. The power of this approach is illustrated by an industrial application
Keywords :
adhesives; analogue integrated circuits; circuit simulation; electric current control; heating; integrated circuit packaging; power integrated circuits; thermal analysis; thermal management (packaging); Si; adhesive layer; analog controlled power circuitry; circuit simulation; electro-thermal circuit simulation; electro-thermal interaction; header; heat diffusion equation; heat propagation; industrial application; power packages; self-heating; silicon die; thermal compact models; Automotive engineering; Circuit simulation; Electronic packaging thermal management; Heating; Mirrors; Nonlinear equations; Silicon; Temperature; Thermal conductivity; Thermal expansion;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International
Conference_Location :
Berlin
Print_ISBN :
0-7803-4520-7
DOI :
10.1109/IEMTE.1998.723075
