DocumentCode
1956137
Title
Professional Program Proceedings. Electronic Industries Forum of New England
fYear
1997
fDate
6-8 May 1997
Abstract
The following topics were dealt with: product development; shielding; heat sinks; wireless telecommunications; switching networks; concurrent engineering; packaging; EMC; SMT; ESD; RF power amplifiers; and ATM networks
Keywords
asynchronous transfer mode; concurrent engineering; electromagnetic compatibility; electrostatic discharge; heat sinks; mobile communication; packaging; power amplifiers; product development; radiofrequency amplifiers; shielding; surface mount technology; switching networks; ATM networks; EMC; ESD; RF power amplifiers; SMT; concurrent engineering; heat sinks; packaging; product development; shielding; switching networks; wireless telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Industries Forum of New England, 1997. Professional Program Proceedings
Conference_Location
Boston, MA, USA
Print_ISBN
0-7803-3987-8
Type
conf
DOI
10.1109/EIF.1997.605369
Filename
605369
Link To Document