DocumentCode :
1956238
Title :
New methods in accelerated reliability testing of electronic components for automotives under field conditions
Author :
Berek, Harry ; Tiederle, Viktor ; Fritzsch, T.
Author_Institution :
Forschungsinstitut fur Nichteisenmatalle Freiberg GmbH, Germany
fYear :
1998
fDate :
27-29 Apr 1998
Firstpage :
143
Lastpage :
146
Abstract :
The reliability of components and circuits is normally determined by standardized methods. Test programs with special parameters must be fixed in contracts between supplier and customer. In order to save time, accelerated tests are used. The results of these tests can only be statements of “passed” or “failed”. Problems arise from the fact that failure rates of components, especially in electronics, become ever smaller. The acceleration factors for the degradation processes involved are often unknown. Overstressing must be avoided. No information is given about such parameters as expected lifetime. FEM methods are promising but still suffer from the lack of knowledge of degradation dependent physical data. Some new developments deal with accelerated testing under field conditions using degradation kinetics. Mathematical models for the active degradation processes are needed. Using high precision measurements, one can obtain experimental data for fitting procedures and for the calculation of reliability parameters. The paper gives some ideas in this area
Keywords :
automotive electronics; circuit reliability; circuit testing; curve fitting; electron device testing; environmental degradation; failure analysis; life testing; FEM methods; accelerated reliability testing methods; accelerated tests; acceleration factors; active degradation processes; automotive electronic components; circuit reliability; component reliability; degradation dependent physical data; degradation kinetics; degradation processes; expected lifetime; failure rate; field conditions; fitting procedures; mathematical models; overstressing; precision measurements; reliability parameters; standardized methods; test program parameters; test programs; Automotive engineering; Bonding; Circuit testing; Contracts; Data analysis; Degradation; Electronic components; Electronic equipment testing; Life estimation; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International
Conference_Location :
Berlin
Print_ISBN :
0-7803-4520-7
Type :
conf
DOI :
10.1109/IEMTE.1998.723076
Filename :
723076
Link To Document :
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