Title :
Building a sustainable future for silicon photonics
Author_Institution :
INTEC-Dept., Ghent Univ., Ghent, Belgium
Abstract :
Silicon photonics presents immense opportunity for innovation in telecom, datacom and sensing. But how do we build the food chain from research to high volume manufacturing? How do we address the issues associated with design tools, industrial fab capability, test and packaging capability?
Keywords :
elemental semiconductors; integrated optics; packaging; silicon; Si; datacom; immense opportunity; industrial fab capability; packaging; sensing; silicon photonics; sustainable future; telecom; volume manufacturing; Companies; Integrated circuit modeling; Manufacturing; Packaging; Photonics; Silicon; Transceivers;
Conference_Titel :
Group IV Photonics (GFP), 2011 8th IEEE International Conference on
Conference_Location :
London
Print_ISBN :
978-1-4244-8338-9
DOI :
10.1109/GROUP4.2011.6053696
