DocumentCode :
1956342
Title :
Device Scaling Issues in GaN Based Double Heterojunction Field-Effect Transistor and Performance Analysis
Author :
Khan, Mohammad ; Maruf, H.M.M. ; Choudhury, M.A.
Author_Institution :
Dept. of Electr. & Electron. Eng., Bangladesh Univ. of Eng. Technol., Dhaka, Bangladesh
fYear :
2013
fDate :
29-31 Jan. 2013
Firstpage :
654
Lastpage :
658
Abstract :
The device performance of GaN based Double Heterojunction Field-Effect Transistor(DHFET) is largely dependent on device scaling issues. The authors´ simulation results show that a decrease in source-gate spacing can improve device performance, enhancing the device output current and the trans conductance. On the contrary, the gate-drain distance does not have significant effect on device performance. It is also observed that an increase in the Aluminium mole fraction of AlGaN buffer causes reduced device transconductance for both AlN/GaN/AlGaN DHFET and AlGaN/GaN/AlGaN DHFET devices and increased gate leakage current for the later one. Based on these results, new optimization strategies for GaN based DHFETs could be defined.
Keywords :
III-V semiconductors; aluminium compounds; buffer circuits; circuit optimisation; gallium compounds; high electron mobility transistors; leakage currents; wide band gap semiconductors; AlGaN-GaN-AlGaN; AlN-GaN-AlGaN; DHFET device; aluminium mole fraction; buffer; device output current; device performance; device scaling; double heterojunction field-effect transistor; gate leakage current; gate-drain distance; optimization strategy; source-gate spacing; transconductance; Aluminum gallium nitride; DH-HEMTs; Gallium nitride; III-V semiconductor materials; Logic gates; Mathematical model; Transconductance; DHFET; Double Heterojunction Field-Effect Transistor; device scaling; gate leakage; power device; transconductance; transfer characteristics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Systems Modelling & Simulation (ISMS), 2013 4th International Conference on
Conference_Location :
Bangkok
ISSN :
2166-0662
Print_ISBN :
978-1-4673-5653-4
Type :
conf
DOI :
10.1109/ISMS.2013.81
Filename :
6498353
Link To Document :
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