• DocumentCode
    1956679
  • Title

    A novel multi-direction high shock reliability test on MEMS devices

  • Author

    Lou, Wenzhong ; Song, Renlong ; Liu, Yunjian ; Liu, Xiaosong ; Li, Weihua ; Lin, Wanfeng

  • Author_Institution
    Nat. Key Lab. of Mechatron. Eng. & Control, Beijing Inst. of Technol., Beijing
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    261
  • Lastpage
    264
  • Abstract
    Most MEMS/NEMS devices are working on the harsh environment, such as high shock and temperature environment, ranging from aerospace science, automobile industry, mechanical engineering, to medical and safety engineering. The reliability of MEMS/NEMS devices is the most important issue today. MEMS devices must perform their required functions for the duration of the equipment´s requirement profile. However, there is a need to implement standardized tests and requirements to ensure the performance of MEMS devices in fielded and emerging military systems. This paper presents the multi-direction high shock environment for MEMS devices, and introduces a dynamic test and shock response spectra (SRS) testing technology. The simulation test of shock environment based equivalent injury theory is studied. A computation program is written in software-Matlab with the modified digital filtering algorithm. The SRS of the shock signal of dispersing is calculated. Also, the simulation of the SRS of dispersing is probed into by using drop test.
  • Keywords
    micromechanical devices; reliability; MEMS devices; digital filtering algorithm; high shock reliability test; shock response spectra; Aerospace industry; Aerospace safety; Aerospace testing; Computational modeling; Electric shock; Microelectromechanical devices; Micromechanical devices; Military computing; Nanoelectromechanical systems; Temperature distribution; High shock; MEMS devices; Reliability Test; SRS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068573
  • Filename
    5068573