• DocumentCode
    1956748
  • Title

    A patch-clamp device with integrated actuators for cell selection and positioning

  • Author

    Gong, Zhongcheng ; Nagarajan, Krithika ; Penmetsa, Siva ; Mills, David ; Que, Long

  • Author_Institution
    Inst. for Micromanufacturing, Louisiana Tech Univ., Ruston, LA
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    278
  • Lastpage
    281
  • Abstract
    A patch-clamp (PC) microchip with integrated air-bubble actuators (AB actuators) for cell positioning is demonstrated, showing the promise for an automated PC microsystem. AB actuators are pneumatic actuators. The air pressure is generated by PDMS membrane mechanical deformation. By integrating with microfluidic channels and PC electrodes, AB actuators can potentially help avoid drawbacks of random cell selection or positioning for a PC microchip, paving the way for an automated PC microsystem. In this effort, the lateral electrode-pipette, located opposite to the outlet of an AB actuator, is designed for trapping a cell. The positioning and capturing of 3T3 cells were demonstrated successfully. Measurements found that the electrode impedance is 1 MOmega; the seal resistance is 5 MOmega with a captured cell. Optimization of the size and shape of the pipette is underway to enhance the seal resistance.
  • Keywords
    bioelectric phenomena; cellular biophysics; deformation; electric impedance; electrodes; microactuators; microfluidics; pneumatic actuators; automated microsystem; cell positioning; cell selection; electrode impedance; integrated air-bubble actuators; lateral electrode-pipette; membrane mechanical deformation; microfluidic channels; patch-clamp device; patch-clamp microchip; pneumatic actuators; random cell selection; seal resistance; Actuators; air bubble actuator; microfluidics; patch-clamp device; patch-clamp electrodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068577
  • Filename
    5068577