DocumentCode
1956772
Title
A taper microstructure for impedance matching
Author
Wu, Dawei ; Harris, Paul ; Young, Roger
Author_Institution
Ind. Res. Ltd., Lower Hutt, New Zealand
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
2076
Lastpage
2079
Abstract
The object of this work is to present the concept of a composite material which consists of many closely packed tapered microrods. The material is intended to be used for ultrasonic transducer matching and fabricated using photolithographic methods. We find that for appropriate microrod diameter and taper, relative to the wavelength, the tapered microrod has a smooth continuous transition in its acoustic impedance. Further for the structures that seem most easily fabricated importantly this includes impedance in the range 3 to 10 MRayl, where there is no useful alternative solid. Wave propagation in the microstructure has been studied with PZFlex finite element modeling and this work shows that when an appropriate taper has been selected that energy transferred is dominated by a single mode. The reflection property of the composite has also been investigated and this data is compared with that for single and dual conventional quarter wave matching layers. It is found that the tapered microrod can provide matching over a very broad frequency range. Unlike loaded epoxy implicitly there is no wave scattering.
Keywords
acoustic impedance; acoustic materials; composite materials; finite element analysis; impedance matching; rods (structures); ultrasonic propagation; ultrasonic reflection; ultrasonic transducers; PZFlex finite element modeling; acoustic impedance; closely packed tapered microrods; composite material; conventional quarter wave matching layer; impedance matching; microrod diameter; photolithographic method; reflection property; taper microstructure; ultrasonic transducer matching; wave propagation; wave scattering; Acoustics; Finite element methods; Impedance; Impedance matching; Materials; Reflection; acoustic matching; impedance; microrod; tapered;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935687
Filename
5935687
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