DocumentCode :
1956853
Title :
A micro amperometric immunosensor immobilized with electropolymerized staphylococcal protein a for the detection of salmonella typhimurium
Author :
Sun Jizhou ; Bian Chao ; Qu Lan ; Xia Shanhong
Author_Institution :
State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing
fYear :
2009
fDate :
5-8 Jan. 2009
Firstpage :
295
Lastpage :
298
Abstract :
In this paper, a micro amperometric immunosensor based on Micro-Electro-Mechanical Systems technology for the detection of Salmonella typhimurium (S. typhimurium) was constructed by immobilizing a polyclonal antibody (the bio-molecular recognition element) onto the surface of polypyrrole(PPy)/staphylococcal protein A(SPA) modified Pt electrode. Pyrrole doped with SPA was co-electropolymerized onto the working electrode surface by cyclic voltammetry in 10 minutes for orientation-controlled immobilization of salmonella capture antibodies. S. typhimurium with the concentration of 102 cfu/ml could be detected by this immunosensor with a controllable and convenient manipulation to effectively modify the sensing surface more rapidly with less consumption of reagent (10 muL), which showed the good property of the sensor. It is potential to develop a micro biosensor that can be used for convenient, accurate, cost-effective and real-time sensing of pathogens in food products.
Keywords :
amperometric sensors; biosensors; microsensors; proteins; voltammetry (chemical analysis); Salmonella typhimurium; cyclic voltammetry; electropolymerized Staphylococcal protein A; micro amperometric immunosensor; micro biosensor; microelectro-mechanical systems technology; salmonella capture antibodies; Biosensors; Circuits; Electrodes; Gold; Immune system; Immunity testing; Micromechanical devices; Proteins; Silicon; Transducers; Amperometric immunosensor; MEMS; Salmonella typhimurium; staphylococcal protein A;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
Type :
conf
DOI :
10.1109/NEMS.2009.5068581
Filename :
5068581
Link To Document :
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