DocumentCode :
1956876
Title :
Characterization of line edge roughness and line width roughness of nano-scale typical structures
Author :
Jiang, Zhuangde ; Zhao, Fengxia ; Jing, Weixuan ; Prewett, Philip D. ; Jiang, Kyle
Author_Institution :
State Key Lab. for Manuf. Syst. Eng., Xi´´an Jiaotong Univ., Xi´´an
fYear :
2009
fDate :
5-8 Jan. 2009
Firstpage :
299
Lastpage :
303
Abstract :
Two kinds of nano-scale typical structures were fabricated for characterizing line edge roughness (LER) and line width roughness (LWR). With Cr and Si3N4 thin films alternately deposited on a silicon substrate and electronic beam lithography employed on a positive resist ZEP520 layer, a nano-scale multiple linewidth standard and a nano-scale grating structure were processed respectively. In regard to the nano-scale multiple linewidth standards, an offline image analysis algorithm of scanning electron microscopy (SEM) image and a random error analysis method were employed to characterize its LER and LWR, including standard deviations 3 sigmaLER and 3 sigmaLWR. With respect to the nano-scale grating structure, sampling and evaluation length, amplitude standard deviation, skewness, kurtosis, auto-correlation function as well as power spectral density function of the nano-scale grating structure were analyzed based on stochastic process analysis to show LER characteristics. Similarly Motif parameters-based analysis also was introduced to get LER characteristics of the nano-scale grating structure.
Keywords :
chromium; electron beam lithography; electron resists; nanofabrication; nanolithography; scanning electron microscopy; silicon compounds; stochastic processes; thin films; Cr; Motif parameters-based analysis; Si; Si3N4; amplitude standard deviation; autocorrelation function; deposition; electronic beam lithography; kurtosis; line edge roughness; line width roughness; nanoscale grating structure; nanoscale multiple linewidth standard; offline image analysis algorithm; positive resist ZEP520 layer; power spectral density function; random error analysis method; scanning electron microscopy; silicon substrate; skewness; stochastic process analysis; thin films; Chromium; Gratings; Image edge detection; Lithography; Nanostructures; Resists; Scanning electron microscopy; Semiconductor thin films; Silicon; Sputtering; Characterization; Fabrication; Line Edge; Line Width Roughness; Roughness; Scanning Electron Microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
Type :
conf
DOI :
10.1109/NEMS.2009.5068582
Filename :
5068582
Link To Document :
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