Title :
Modeling analysis of piezoelectric micromachined modal gyroscope (PMMG)
Author :
Wu, Xiaosheng ; Chen, Wenyuan ; Zhang, Weiping ; Lu, Yipeng ; Cui, Feng ; Zhao, Xiaolin
Author_Institution :
Res. Inst. of Micro/Nano Sci. & Technol., Shanghai Jiao Tong Univ., Shanghai
Abstract :
A novel kind of MEMS micro-gyroscope, piezoelectric micromachined modal gyroscope (PMMG), is introduced in the paper. PMMG works with the special vibratory mode of solid material, and it is a kind of solid-state micro-gyroscope, which is different from micromachined vibratory gyroscope. There is no moving part and suspended structure in PMMG, and it is robust for the higher resistance to shock and shake. PMMG has no special requirement on vacuum package, so it has higher stability and reliability. The working mechanism of PMMG is introduced in the paper. A model of PMMG with concentrated masses is proposed in the paper, and using finite element method (FEM), its modal and harmonic analysis are compared with the model without concentrated mass. The results show that the model with concentrated masses has lower modal frequency and larger vibratory amplitude. The Coriolis effect analysis of the two kinds of model shows that the model with concentrated mass is favorable to increase the sensitivity of PMMG. The work of the paper provides theory foundation for further research of PMMG.
Keywords :
finite element analysis; gyroscopes; harmonic analysis; micromachining; micromechanical devices; modal analysis; reliability; Coriolis effect analysis; MEMS microgyroscope; finite element method; harmonic analysis; modal analysis; piezoelectric micromachined modal gyroscope; reliability; suspended structure; Electric shock; Finite element methods; Frequency; Gyroscopes; Harmonic analysis; Micromechanical devices; Packaging; Robustness; Solid state circuits; Stability; Micromachined Gyroscope; Modal; Model; Piezoelectric; concentrated masses;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
DOI :
10.1109/NEMS.2009.5068583