DocumentCode
1956925
Title
The micropatterns of glutaraldehyde-crosslinked gelatin as ECM for attachment of tumor cells
Author
Yu-Cheng Ou ; Chih-Wen Hsu ; Lung-Jieh Yang ; Han, Hsieh-Cheng ; Liu, Yi-Wen ; Chen, Chien-Yuan
Author_Institution
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
314
Lastpage
318
Abstract
Use of this work proposes a novel technique to induce the attachment of tumor cells to the micropatterns of glutaraldehyde (GA)-crosslinked gelatin. It provides another method to crosslink gelatin other than using the photo-sensitizing agents or selective GA-crosslinked technique. The micropatterns of GA-crosslinked gelatin are fabricated by O2 plasma etching process. This novel technique can ensure the degree of crosslink, prevent the over-crosslink from pattern deformation and enhance the adhesion between the gelatin and glass slide. The best spatial resolution of the micro gelatin bases can be reached to 2 mum. The micropatterns of GA-crosslinked gelatin can still be made successfully by the conventional photolithography. The much less toxic and more biocompatible approaches of strengthening the gelatin microstructures can be developed according to the idea herein.
Keywords
adhesion; biochemistry; biological techniques; cancer; cellular biophysics; deformation; gelatin; molecular biophysics; photochemistry; photolithography; tumours; ECM; GA-crosslinked gelatin fabrication; adhesion enhancement; conventional photolithography; extracellular matrix protein; glutaraldehyde-crosslinked gelatin micropattern; pattern deformation; photo-sensitizing agent; plasma etching process; selective GA-crosslinked technique; spatial resolution; tumor cell attachment; Adhesives; Electrochemical machining; Extracellular; Fabrication; Glass; Resists; Stem cells; Substrates; Systems engineering and theory; Tumors; Attachment; Gelatin; Glutaraldehyde; Tumor cells;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068585
Filename
5068585
Link To Document