DocumentCode :
1956978
Title :
Thermal analysis software picks optimum heat sink design
Author :
Chapman, Christopher L.
Author_Institution :
Dept. of Comput. Ind., Aavid Thermal Technol. Inc., USA
fYear :
1997
fDate :
6-8 May 1997
Firstpage :
37
Lastpage :
42
Abstract :
Though seemingly simple, heat sinks are complex designs that balance at least eight variables to achieve optimum performance. This balancing act is especially important in designs for digital applications where shrinking packaging size makes it increasingly difficult to remove heat. For best results, the heat sink should be designed specifically to fit the application. An optimum design significantly lowers final product cost: increases reliability, and shortens product time-to-market. It can even enhance electrical performance, such as with computer chips where clock speed is related to junction temperature
Keywords :
circuit CAD; cooling; heat sinks; integrated circuit packaging; integrated circuit reliability; thermal analysis; clock speed; digital applications; electrical performance; final product cost; heat sink design; junction temperature; optimum performance; packaging size; product time-to-market; reliability; thermal analysis software; Application software; Computational fluid dynamics; Design engineering; Electric resistance; Equations; Geometry; Heat engines; Heat sinks; Heat transfer; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Industries Forum of New England, 1997. Professional Program Proceedings
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-3987-8
Type :
conf
DOI :
10.1109/EIF.1997.605373
Filename :
605373
Link To Document :
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