Title :
Effect of contamination on copper migration in TAB tape structures
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
Copper migration in adhesive of Tape Automated Bonding (TAB) tape during biased moisture stress can cause failure. Experiments aimed at reducing copper migration show that copper precipitation lengths after HAST are linearly proportional to chloride concentration in the TAB tape material. Discharge potential measurements of TAB tape in 156 /spl deg/C bake are correlated to chloride concentration.<>
Keywords :
circuit reliability; failure analysis; integrated circuit testing; tape automated bonding; 156 degC; HAST; TAB tape structures; adhesive; biased moisture stress; chloride concentration; copper migration; discharge potential measurements; precipitation lengths; Clamps; Conducting materials; Conductors; Contamination; Copper; Packaging; Performance evaluation; Plastics; Stress; Testing;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307852
