Title :
Ambient moisture characterization of thin small outline packages (TSOPs)
Author_Institution :
Motorola Inc., Austin, TX, USA
Abstract :
Two types of TSOPs were characterized with ambient preconditioning stresses to determine their true moisture sensitivity to solder reflow induced damage. The results reveal that traditional accelerated preconditioning stresses do not properly predict this package´s moisture sensitivity. Furthermore, the current model for predicting reflow damage may be ineffective for thinner packages since it only considers the amount of moisture absorbed and not the distribution of moisture.<>
Keywords :
circuit reliability; life testing; moisture measurement; packaging; soldering; TSOPs; ambient moisture characterization; moisture sensitivity; preconditioning stresses; solder reflow induced damage; thin small outline packages; Absorption; Acoustic pulses; Adhesives; Delamination; Lead; Moisture; Plastic packaging; Stress; Surface-mount technology; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307853
