• DocumentCode
    1957518
  • Title

    Fabrication of bulk titanium out-of-plane microneedles

  • Author

    Zhao, Gang ; Li, Wen ; Tang, Guanrong ; Chen, Jing

  • Author_Institution
    Nat. Key Lab. of Nano/Micro Fabrication Technol., Peking Univ., Beijing
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    428
  • Lastpage
    431
  • Abstract
    In this study, isotropic wet etching technology has been developed to achieve the pyramidal needle structures on one side polished chemical pure titanium substrate. Different etchants, mask materials and substrate materials combinations were investigated respectively for process optimization. A steady etch rate in excess of 2 mum/min has been achieved with sputtered Ni mask. For the first time, bulk titanium out-of-plane microneedle array was fabricated with excellent sharpness. By aqueous oxidation, nanostructured porous titania was generated on the surface of the microneedle, which not only enhanced the biocompatibility of titanium devices and implants but also provided an approach for drug loading. With its high fracture toughness, high strength, and excellent biocompatibility, the bulk titanium out-of-plane microneedles may play an important role in the future clinical applications.
  • Keywords
    bioMEMS; drug delivery systems; fracture toughness; masks; microfabrication; nanoporous materials; nanotechnology; needles; oxidation; sputter etching; titanium compounds; Ti; TiO2; aqueous oxidation; drug loading; fracture toughness; isotropic wet etching technology; mask material; nanostructured porous titania; polished chemical pure titanium substrate; pyramidal needle structures; sputter etching; substrate material; titanium out-of-plane microneedle fabrication; Chemical technology; Fabrication; Nanoscale devices; Nanostructured materials; Needles; Oxidation; Sputter etching; Surface cracks; Titanium; Wet etching; bulk titanium; microneedles; out-of-plane; titania; wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068611
  • Filename
    5068611