DocumentCode
1957518
Title
Fabrication of bulk titanium out-of-plane microneedles
Author
Zhao, Gang ; Li, Wen ; Tang, Guanrong ; Chen, Jing
Author_Institution
Nat. Key Lab. of Nano/Micro Fabrication Technol., Peking Univ., Beijing
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
428
Lastpage
431
Abstract
In this study, isotropic wet etching technology has been developed to achieve the pyramidal needle structures on one side polished chemical pure titanium substrate. Different etchants, mask materials and substrate materials combinations were investigated respectively for process optimization. A steady etch rate in excess of 2 mum/min has been achieved with sputtered Ni mask. For the first time, bulk titanium out-of-plane microneedle array was fabricated with excellent sharpness. By aqueous oxidation, nanostructured porous titania was generated on the surface of the microneedle, which not only enhanced the biocompatibility of titanium devices and implants but also provided an approach for drug loading. With its high fracture toughness, high strength, and excellent biocompatibility, the bulk titanium out-of-plane microneedles may play an important role in the future clinical applications.
Keywords
bioMEMS; drug delivery systems; fracture toughness; masks; microfabrication; nanoporous materials; nanotechnology; needles; oxidation; sputter etching; titanium compounds; Ti; TiO2; aqueous oxidation; drug loading; fracture toughness; isotropic wet etching technology; mask material; nanostructured porous titania; polished chemical pure titanium substrate; pyramidal needle structures; sputter etching; substrate material; titanium out-of-plane microneedle fabrication; Chemical technology; Fabrication; Nanoscale devices; Nanostructured materials; Needles; Oxidation; Sputter etching; Surface cracks; Titanium; Wet etching; bulk titanium; microneedles; out-of-plane; titania; wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068611
Filename
5068611
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