DocumentCode
1957535
Title
A Numerical Simulation of Motion of Particles under the Wafer in CMP
Author
Zhang, Hao ; Tan, Yuanqiang ; Li, Mingjun
Author_Institution
Sch. of Math. & Comput. Sci., Xiangtan Univ., Xiangtan
Volume
3
fYear
2008
fDate
12-14 Dec. 2008
Firstpage
31
Lastpage
34
Abstract
Motion of particles in two-phase flow between two rotary pads is simulated with coupled lattice Boltzmann method (LBM) and discrete element method (DEM), in which the LBM is used for calculating the fluid flow, while the DEM for accounting for the interaction between the moving particles, both the particles and the pads are constructed by the ´boundary´ in LBM. Numerically, flow field on the down-pad is simulated, two vortexes are found; Pressure maps are observed with different pad angle velocities; Finally motion of particles are investigated, our results show that most of the particles between the pads get out of the interlayer at nearly the same place, and the trajectory is like a parabola at the left hand side of the up-pad, all of them demonstrate the capability of the presented coupling strategy.
Keywords
chemical mechanical polishing; flow simulation; lattice Boltzmann methods; discrete element method; fluid flow; fluid/particle interaction; lattice Boltzmann method; vortexes; wafer; Computational modeling; Computer science; Computer simulation; Fluid flow; Friction; Lattice Boltzmann methods; Numerical simulation; Software engineering; Trajectory; Tribology; discrete element method; fluid/particle interaction; lattice Boltzmann method; motion of particles;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Software Engineering, 2008 International Conference on
Conference_Location
Wuhan, Hubei
Print_ISBN
978-0-7695-3336-0
Type
conf
DOI
10.1109/CSSE.2008.463
Filename
4722283
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