• DocumentCode
    1957535
  • Title

    A Numerical Simulation of Motion of Particles under the Wafer in CMP

  • Author

    Zhang, Hao ; Tan, Yuanqiang ; Li, Mingjun

  • Author_Institution
    Sch. of Math. & Comput. Sci., Xiangtan Univ., Xiangtan
  • Volume
    3
  • fYear
    2008
  • fDate
    12-14 Dec. 2008
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    Motion of particles in two-phase flow between two rotary pads is simulated with coupled lattice Boltzmann method (LBM) and discrete element method (DEM), in which the LBM is used for calculating the fluid flow, while the DEM for accounting for the interaction between the moving particles, both the particles and the pads are constructed by the ´boundary´ in LBM. Numerically, flow field on the down-pad is simulated, two vortexes are found; Pressure maps are observed with different pad angle velocities; Finally motion of particles are investigated, our results show that most of the particles between the pads get out of the interlayer at nearly the same place, and the trajectory is like a parabola at the left hand side of the up-pad, all of them demonstrate the capability of the presented coupling strategy.
  • Keywords
    chemical mechanical polishing; flow simulation; lattice Boltzmann methods; discrete element method; fluid flow; fluid/particle interaction; lattice Boltzmann method; vortexes; wafer; Computational modeling; Computer science; Computer simulation; Fluid flow; Friction; Lattice Boltzmann methods; Numerical simulation; Software engineering; Trajectory; Tribology; discrete element method; fluid/particle interaction; lattice Boltzmann method; motion of particles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Software Engineering, 2008 International Conference on
  • Conference_Location
    Wuhan, Hubei
  • Print_ISBN
    978-0-7695-3336-0
  • Type

    conf

  • DOI
    10.1109/CSSE.2008.463
  • Filename
    4722283