DocumentCode
1957541
Title
Spiral capacitor based on copper electroplating
Author
Chen, Yue ; Li, Xiuhan ; Fang, Dongming ; Yuan, Quan ; Zhang, Haixia
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
432
Lastpage
435
Abstract
A novel MEMS spiral capacitor on glass substrate has been designed, simulated and fabricated. The square spiral capacitors with different width, space, thickness and turn number have been studied by HFSS. The fabrication process has been developed based on copper electroplating, and it is compatible with the copper inductor fabrication process, which can be integrated into LC filter. Finally, spiral capacitors with different dimensions and LC filters have been fabricated successfully.
Keywords
capacitors; copper; electroplating; micromechanical devices; radiofrequency filters; HFSS; LC filters; MEMS spiral capacitor; copper electroplating; glass substrate; inductor fabrication process; square spiral capacitors; Capacitance; Capacitors; Copper; Fabrication; Filters; Frequency; Glass; Micromechanical devices; Q factor; Spirals; HFSS; Spiral capacitor; copper electroplating; integratable;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068612
Filename
5068612
Link To Document