• DocumentCode
    1958166
  • Title

    High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit

  • Author

    Zimmermann, L. ; Preve, G.B. ; Voigt, K. ; Winzer, G. ; Kreissl, J. ; Moerl, L. ; Stamatiadis, C. ; Stampoulidis, L. ; Avramopoulos, H.

  • Author_Institution
    IHP Microelectron. GmbH, Frankfurt (Oder), Germany
  • fYear
    2011
  • fDate
    14-16 Sept. 2011
  • Firstpage
    237
  • Lastpage
    239
  • Abstract
    High-precision hybrid integration on SOI photonic circuit was developed. The technology was applied to fabricate an integrated high-speed all-optical wavelength converter. Potential of the platform was demonstrated by 40Gb/s all-optical wavelength switching.
  • Keywords
    flip-chip devices; integrated optics; optical fabrication; optical switches; optical wavelength conversion; silicon-on-insulator; SOI photonic circuit; Si; bit rate 40 Gbit/s; high-precision flip-chip technology; high-precision hybrid integration; integrated high-speed all-optical wavelength converter; optical wavelength switching; Chirp; Optical fibers; Optical filters; Optical interferometry; Optical wavelength conversion; Semiconductor optical amplifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2011 8th IEEE International Conference on
  • Conference_Location
    London
  • ISSN
    1949-2081
  • Print_ISBN
    978-1-4244-8338-9
  • Type

    conf

  • DOI
    10.1109/GROUP4.2011.6053775
  • Filename
    6053775
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1958166