Advanced automation technology for photonics packaging delivers improved device performance and lower cost

Automation is playing an increasingly key role in photonics device manufacturing now that the markets are demanding larger volumes. High-precision machinery is now becoming commercially available which can offer turn-key production solutions to photonics assembly and test applications. Automated alignment and device testing, along with more robust attachment techniques (like laser welding), are improving device-to-device consistency, enhancing package environmental resistance, lowering costs and enabling manufacturers to maximize the performance of their devices and their systems