DocumentCode :
1958597
Title :
n- and p-channel TaN/HfO2 MOSFETs on GaAs substrate using a germanium interfacial passivation layer
Author :
Kim, Hyoung-Sub ; Ok, Injo ; Zhu, Feng ; Zhang, M. ; Park, S. ; Yum, J. ; Zhao, H. ; Lee, Jack C.
Author_Institution :
Univ. of Texas, Austin
fYear :
2007
fDate :
18-20 June 2007
Firstpage :
99
Lastpage :
100
Abstract :
Using a thin germanium interfacial passivation layer (IPL), for the first time we present surface channel n- and p-MOSFETs on GaAs substrate with TaN gate electrodes and HfO2 dielectric films. We used self-aligned and gate-last processes to fabricate MOSFETs on semi-insulating GaAs substrate. The electrical results from the buried channel and the surface channel-mode transistors are investigated. Both n- and p-channel transistors show excellent surface channel dc output characteristics, providing a good possibility of utilizing GaAs in CMOS technology.
Keywords :
III-V semiconductors; MOSFET; dielectric thin films; gallium arsenide; hafnium compounds; passivation; tantalum compounds; wide band gap semiconductors; CMOS technology; GaAs; TaN-HfO2; buried channel; dielectric films; gate electrodes; gate-last process; germanium interfacial passivation layer; n-channel MOSFET; p-channel MOSFET; self-aligned process; semi-insulating substrate; surface channel dc output characteristics; surface channel n-MOSFET; surface channel p-MOSFET; surface channel-mode transistors; Capacitance-voltage characteristics; Dielectric substrates; Gallium arsenide; Germanium; Hafnium oxide; MOSFET circuits; Passivation; Rough surfaces; Surface cleaning; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2007 65th Annual
Conference_Location :
Notre Dame, IN
ISSN :
1548-3770
Print_ISBN :
978-1-4244-1101-6
Electronic_ISBN :
1548-3770
Type :
conf
DOI :
10.1109/DRC.2007.4373668
Filename :
4373668
Link To Document :
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