DocumentCode
1958897
Title
Corner effects in SOI-Tri gate FinFET structure by using 3D Process and device simulations
Author
Kumar, Pavan M. ; Gupta, Santosh Kr ; Paul, Madhumita
Author_Institution
ECE Dept., NIT Silchar, Silchar, India
Volume
9
fYear
2010
fDate
9-11 July 2010
Firstpage
704
Lastpage
707
Abstract
SOI FinFET transistors have emerged as novel devices having superior controls over short channel effects (SCE) than the conventional MOS transistor devices. However despite these advantages, these also exhibit certain other undesirable characteristics such as corner effects, quantum effects, tunneling etc. Usually, the corner effect deteriorates the performance by increasing the leakage current. In this work, the corner effect of Tri-gate FinFETs are investigated by 3D Process and device simulation and their electrical characteristics are compared for different body doping and bias conditions. It has been observed that the corner effect in small size SOI tri gated FinFETs for typical device parameters do not deteriorate the performance. An enhancement in the on state current and sub-threshold performance have been observed.
Keywords
MOSFET; elemental semiconductors; semiconductor device models; semiconductor doping; silicon; silicon-on-insulator; 3D process; SOI FinFET transistor device simulations; SOI-trigate FinFET structure; Si; bias effect; corner effects; doping; electrical characteristics; leakage current; on-state current; short channel effects; subthreshold performance; triple gate FinFET; CMOS integrated circuits; Logic gates; Performance evaluation; Semiconductor device modeling; Silicon; Variable speed drives; Corner effect; Premature inversion; Quantum Effect; SCE; Tri gate-FinFET;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-5537-9
Type
conf
DOI
10.1109/ICCSIT.2010.5565081
Filename
5565081
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