Title : 
Crosstalk fault detection by dynamic I/sub dd/
         
        
            Author : 
Xiaoyun Sun ; Seonki Kim ; Vinnakota, B.
         
        
            Author_Institution : 
Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA
         
        
        
        
        
        
            Abstract : 
Undesired capacitive crosstalk between signals is expected to be a significant concern in deep submicron circuits. New test techniques are needed for these crosstalk faults since they may cause unacceptable performance degradation. We analyze the impact of crosstalk faults on a circuit´s power dissipation. Crosstalk faults can be detected by monitoring the dynamic supply current. The test method is based on a recently developed dynamic I/sub dd/ test metric, the energy consumption ratio (ECR). ECR-based test has been shown to be effective at tolerating the impact of process variations. In this paper, we apply an ECR-based test method called ECR-VDD test to detect the crosstalk faults. The effectiveness of the method is demonstrated by simulation results.
         
        
            Keywords : 
CMOS digital integrated circuits; VLSI; crosstalk; delays; fault diagnosis; integrated circuit testing; logic simulation; logic testing; low-power electronics; CMOS; capacitive crosstalk; crosstalk fault detection; deep submicron circuits; delays; dynamic I/sub dd/; dynamic supply current; energy consumption ratio; performance degradation; power dissipation; process variations; test techniques; Circuit faults; Circuit testing; Crosstalk; Current supplies; Degradation; Electrical fault detection; Energy consumption; Fault detection; Monitoring; Power dissipation;
         
        
        
        
            Conference_Titel : 
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
         
        
            Conference_Location : 
San Jose, CA, USA
         
        
        
            Print_ISBN : 
0-7803-7247-6
         
        
        
            DOI : 
10.1109/ICCAD.2001.968650