• DocumentCode
    1959201
  • Title

    Low profile silicon photonics packaging approach featuring configurable multiple electrical and optical connectivity

  • Author

    Galan, J.V. ; Tekin, T. ; Preve, G.B. ; Brimont, A. ; Llopis, M. ; Sanchis, P.

  • Author_Institution
    Nanophotonics Technol. Center, Univ. Politec. de Valencia, Valencia, Spain
  • fYear
    2011
  • fDate
    14-16 Sept. 2011
  • Firstpage
    377
  • Lastpage
    379
  • Abstract
    A package solution for silicon photonic integrated circuits with multiple input/output grating-based optical interfaces is proposed and experimentally demonstrated. The approach is based on using a subassembly sub-mount carrier to maintain standard-compatible lateral orientation for the fibers in the package.
  • Keywords
    electronics packaging; integrated optics; optical couplers; silicon; configurable multiple electrical and optical connectivity; low profile silicon photonics packaging; multiple input/output grating; optical interfaces; package solution; silicon photonic integrated circuits; standard compatible lateral orientation; subassembly submount carrier; Arrays; Couplers; Gratings; Optical fiber couplers; Optical fiber devices; Integrated optics; grating couplers; packaging; silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2011 8th IEEE International Conference on
  • Conference_Location
    London
  • ISSN
    1949-2081
  • Print_ISBN
    978-1-4244-8338-9
  • Type

    conf

  • DOI
    10.1109/GROUP4.2011.6053822
  • Filename
    6053822
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1959201