Title :
Fast 3-D inductance extraction in lossy multi-layer substrate
Author :
Minqing Liu ; Tiejun Yu ; Dai, W.W.-M.
Author_Institution :
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
Abstract :
A mixed potential integral equation (MPIE) technique combined with fast multi-layer Green´s functions and Gaussian Jacobi high order techniques is used to compute the 3-D frequency dependent inductances and resistances in lossy multi-layered substrates. Compared to FastHenry, a multipole-accelerated 3-D inductance extraction program, the algorithm presented here is more accurate and faster for lossy multi-layer structures for two reasons. First, substrate and optional ground plane loss and coupling effect are efficiently modeled by multilayer Green´s functions, while the Green´s functions are efficiently calculated via a window-based acceleration technique. Second, Gaussian Jacobi-based high order techniques are used to capture the singularity of the current distribution at metal edges, leading to significant reduction of problem size and speed-up of computation.
Keywords :
Green´s function methods; MMIC; UHF integrated circuits; current distribution; inductance; integral equations; integrated circuit modelling; substrates; 3D frequency dependent inductances; 3D frequency dependent resistances; Gaussian Jacobi high order techniques; MMIC; MPIE technique; RFICs; coupling effect; current distribution; fast 3D inductance extraction; fast multilayer Green´s functions; ground plane; lossy multilayer substrate; metal edges; mixed potential integral equation technique; monolithic microwave ICs; spiral inductors; substrate loss; window-based acceleration technique; Acceleration; Current distribution; Distributed computing; Frequency dependence; Green´s function methods; Inductance; Integral equations; Jacobian matrices; Lead; Nonhomogeneous media;
Conference_Titel :
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7247-6
DOI :
10.1109/ICCAD.2001.968663