• DocumentCode
    1959308
  • Title

    Fast 3-D inductance extraction in lossy multi-layer substrate

  • Author

    Minqing Liu ; Tiejun Yu ; Dai, W.W.-M.

  • Author_Institution
    Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
  • fYear
    2001
  • fDate
    4-8 Nov. 2001
  • Firstpage
    424
  • Lastpage
    429
  • Abstract
    A mixed potential integral equation (MPIE) technique combined with fast multi-layer Green´s functions and Gaussian Jacobi high order techniques is used to compute the 3-D frequency dependent inductances and resistances in lossy multi-layered substrates. Compared to FastHenry, a multipole-accelerated 3-D inductance extraction program, the algorithm presented here is more accurate and faster for lossy multi-layer structures for two reasons. First, substrate and optional ground plane loss and coupling effect are efficiently modeled by multilayer Green´s functions, while the Green´s functions are efficiently calculated via a window-based acceleration technique. Second, Gaussian Jacobi-based high order techniques are used to capture the singularity of the current distribution at metal edges, leading to significant reduction of problem size and speed-up of computation.
  • Keywords
    Green´s function methods; MMIC; UHF integrated circuits; current distribution; inductance; integral equations; integrated circuit modelling; substrates; 3D frequency dependent inductances; 3D frequency dependent resistances; Gaussian Jacobi high order techniques; MMIC; MPIE technique; RFICs; coupling effect; current distribution; fast 3D inductance extraction; fast multilayer Green´s functions; ground plane; lossy multilayer substrate; metal edges; mixed potential integral equation technique; monolithic microwave ICs; spiral inductors; substrate loss; window-based acceleration technique; Acceleration; Current distribution; Distributed computing; Frequency dependence; Green´s function methods; Inductance; Integral equations; Jacobian matrices; Lead; Nonhomogeneous media;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-7247-6
  • Type

    conf

  • DOI
    10.1109/ICCAD.2001.968663
  • Filename
    968663