Title :
Simulation approaches for strongly coupled interconnect systems
Author :
Phillips, J.R. ; Silveira, L.M.
Author_Institution :
Cadence Berkeley Labs., Cadence Design Syst. Inc., San Jose, CA, USA
Abstract :
Shrinking feature sizes and increasing speeds of operation make interconnect-related effects very relevant for current circuit verification methodologies. Reliable and accurate system verification requires the full analysis of circuits together with the environment that surrounds them, including the common substrate, the packaging structures, and perhaps even board information. In this paper we discuss circuit-level simulation algorithms that enable the analysis of the impact of strongly coupled interconnect structures on nonlinear circuit operation, so as to allow reliable and accurate system verification.
Keywords :
circuit simulation; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; integration; iterative methods; matrix algebra; substrates; circuit verification; circuit-level simulation algorithms; common substrate; full substrate models; matrix truncations; nonlinear circuit operation; strongly coupled interconnect systems; substrate coupling modelling; system verification; truncated substrate models; Buildings; Circuit analysis; Circuit noise; Circuit simulation; Coupling circuits; Inductance; Information analysis; Integrated circuit interconnections; Laboratories; Packaging;
Conference_Titel :
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7247-6
DOI :
10.1109/ICCAD.2001.968665