DocumentCode
1959417
Title
Infrared heating and roller-based contact printing technology for the fabrication of micro/nano-structures
Author
Lee, Yung-Chun ; Chen, Hsueh-Liang ; Chen, Chun-Hung ; Lin, Hung-Yi
Author_Institution
Dept. of Nanotechnol. & Microsyst. Eng., Nat. Cheng Kung Univ., Tainan
fYear
2009
fDate
5-8 Jan. 2009
Firstpage
779
Lastpage
782
Abstract
This paper presents a new roller-based nano-imprinting method based on the Infrared assisted metal transfer technique. It utilizes a silicon mold which is deposited with a thin metal film for pattern transferring. Another metal film which acts as an adhesion layer is also deposited on the substrate surface. An infrared light source incident from the substrate side heats up the metal films. After imprinting, the patterned metal film defined by sub-micro- and nano-scale features of the mold can be transferred from the mold to the substrate. A glass roller is introduced in this new method. Optically, the glass roller is acting like a cylindrical lens which can focus the infrared light into a line source at the mold/substrate interface. Mechanically, the roller provides a constant line-type contact pressure between the mold and substrate. In this paper, quartz substrates have been successfully patterned and, after appropriated etching processes, quartz molds are obtained.
Keywords
heat treatment; infrared sources; metallic thin films; microfabrication; nanofabrication; nanolithography; nanopatterning; quartz; soft lithography; substrates; SiO2; adhesion layer; etching; glass roller; infrared assisted metal transfer technique; infrared heating; infrared light source; metal transfer; nanoimprinting method; quartz substrates; roller-based contact printing technology; silicon mold; thin metal film; Adhesives; Fabrication; Glass; Infrared heating; Light sources; Optical films; Printing; Semiconductor films; Silicon; Substrates; contact; metal transfer; roller imprinting;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-4629-2
Electronic_ISBN
978-1-4244-4630-8
Type
conf
DOI
10.1109/NEMS.2009.5068694
Filename
5068694
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