DocumentCode :
1959586
Title :
InGaAs CMOS: a "Beyond-the-Roadmap" Logic Technology?
Author :
Alamo, J. A del ; Kim, D.H.
Author_Institution :
Massachusetts Inst. of Technol., Cambridge
fYear :
2007
fDate :
18-20 June 2007
Firstpage :
201
Lastpage :
202
Abstract :
This talk will discuss the general issues associated with III-V CMOS that are enunciated above. It will also describe the authors´ research activities in the area of InGaAs HEMTs for logic. In particular, we will summarize the findings of a recent scaling study of InGaAs HEMTs down to 60 nm in gate length [1]. In this work, we fabricated HEMTs with a 70% InAs composition in the channel and with varying gate lengths and InAIAs barrier thicknesses (from 11 to 3 nm). This study resulted in devices that have substantially more current drive than state-of-the-art 65 nm CMOS at a voltage of 0.5 V. It also showed that InGaAs HEMTs scale according to a simple electrostatics law similar to fully-depleted SOI MOSFETs. Our research reveals that HEMTs are excellent test vehicles to study topics of great relevance to future III-V MISFETs, such as self-aligned device architectures, scaling limit of planar devices, impact of strain on transport physics, and the consequences of a low density of states on current drive of deeply scaled devices..
Keywords :
CMOS integrated circuits; HEMT integrated circuits; III-V semiconductors; gallium arsenide; indium compounds; HEMT; III-V CMOS; InGaAs; barrier thicknesses; electrostatics law; fully-depleted SOI MOSFET; self-aligned device; Automatic testing; CMOS logic circuits; CMOS technology; Electrostatics; HEMTs; III-V semiconductor materials; Indium gallium arsenide; MODFETs; MOSFETs; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference, 2007 65th Annual
Conference_Location :
Notre Dame, IN
ISSN :
1548-3770
Print_ISBN :
978-1-4244-1101-6
Electronic_ISBN :
1548-3770
Type :
conf
DOI :
10.1109/DRC.2007.4373717
Filename :
4373717
Link To Document :
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