• DocumentCode
    1959605
  • Title

    Microfluidic patterning of nanoparticle monolayer: Mechanism analysis and noncontinuously patterning approach

  • Author

    Zhen Chen ; Zhao, Yu ; Wang, Wei ; Zhihong Li

  • Author_Institution
    Coll. of Chem. & Mol. Eng., Peking Univ., Beijing
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    818
  • Lastpage
    821
  • Abstract
    Presently, with the development of nanofabrications, patterning nanoparticles into monolayer attracts tremendous interests. In this work, a microfluidic-assisted nanoparticle monolayer patterning approach was proposed to produce noncontinuous patterns based on the well-known continuity equation in fluid mechanics. Soft-lithography used in this approach greatly reduced the cost and time of the fabrication process. In addition, nanoparticles sedimentation and washing are found to be two important processes to obtain high quality nanoparticle monolayer patterns, and by tuning technique parameters, such as channel size, flow rate, working time, etc., mechanism of the novel microfluidic patterning technique was studied to interpret the whole patterning process and guide the patterning microchannel design. Noncontinuous nanoparticle monolayer patterns were realized simultaneously by varying the width within a single microchannel, which further widened the applicability of this technique in the nanofabrications.
  • Keywords
    microchannel flow; microfluidics; monolayers; nanoparticles; nanopatterning; soft lithography; microchannel; microfluidic patterning; nanofabrications; nanoparticle monolayer; sedimentation; soft lithography; Costs; Fabrication; Lithography; Microchannel; Microelectronics; Microfluidics; Nanoparticles; Pattern analysis; Scanning electron microscopy; Substrates; Isolated patterning; Microfluidic; Nanoparticle monolayer; PDMS;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068702
  • Filename
    5068702