DocumentCode :
1959762
Title :
Current capacity and thermal transport in carbon nanofiber interconnects
Author :
Fabris, Drazen ; Saito, Tsutomu ; Yamada, Toshishige ; Sun, Xuhui ; Wilhite, Patrick ; Yang, Cary Y.
Author_Institution :
Santa Clara Center for Nanostruct., Santa Clara Univ., Santa Clara, CA
fYear :
2009
fDate :
5-8 Jan. 2009
Firstpage :
848
Lastpage :
853
Abstract :
Carbon nanofibers (CNF) are studied in a horizontal configuration as a model for on-chip interconnects. The electrical performance is determined by both CNF resistivity and contact resistance with electrodes. Reliability and current capacity are determined by Joule heating in the system and the thermal accompanying transport. We show that current capacity can be modeled by accounting for the nature of the contacts with the substrate and with the electrodes.
Keywords :
carbon; contact resistance; electrical resistivity; interconnections; nanostructured materials; reliability; C; Joule heating; carbon nanofiber interconnects; contact resistance; current capacity; electrodes; on-chip interconnects; reliability; thermal transport; Conductivity; Electric resistance; Electrodes; Electrons; Nanoscale devices; Nanostructures; Plasma temperature; Reliability engineering; Thermal resistance; USA Councils; micro/nano electromechanical systems; nanomaterials; nanotube/nanowire devices; thermal transport;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
Type :
conf
DOI :
10.1109/NEMS.2009.5068708
Filename :
5068708
Link To Document :
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