Current capacity and thermal transport in carbon nanofiber interconnects

Author

Fabris, Drazen ; Saito, Tsutomu ; Yamada, Toshishige ; Sun, Xuhui ; Wilhite, Patrick ; Yang, Cary Y.

Author_Institution

Santa Clara Center for Nanostruct., Santa Clara Univ., Santa Clara, CA

fYear

2009

fDate

5-8 Jan. 2009

Firstpage

848

Lastpage

853

Abstract

Carbon nanofibers (CNF) are studied in a horizontal configuration as a model for on-chip interconnects. The electrical performance is determined by both CNF resistivity and contact resistance with electrodes. Reliability and current capacity are determined by Joule heating in the system and the thermal accompanying transport. We show that current capacity can be modeled by accounting for the nature of the contacts with the substrate and with the electrodes.

Keywords

carbon; contact resistance; electrical resistivity; interconnections; nanostructured materials; reliability; C; Joule heating; carbon nanofiber interconnects; contact resistance; current capacity; electrodes; on-chip interconnects; reliability; thermal transport; Conductivity; Electric resistance; Electrodes; Electrons; Nanoscale devices; Nanostructures; Plasma temperature; Reliability engineering; Thermal resistance; USA Councils; micro/nano electromechanical systems; nanomaterials; nanotube/nanowire devices; thermal transport;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on

Conference_Location

Shenzhen

Print_ISBN

978-1-4244-4629-2

Electronic_ISBN

978-1-4244-4630-8

Type

conf

DOI

10.1109/NEMS.2009.5068708

Filename

5068708