• DocumentCode
    1959914
  • Title

    Functionalized bio-nanoparticles in immunosensing using Surface-Enhanced Raman scattering methods

  • Author

    Lin, Chi-Chang ; Yu, Chen-Yuan ; Yang, Ying-Mei ; Chen, Yan-Fu ; Chang, Hsien-Chang

  • Author_Institution
    Inst. of Biomed. Eng., Nat. Cheng Kung Univ., Tainan
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    877
  • Lastpage
    880
  • Abstract
    An unique, sensitive, and highly specific immunoassay system using gold nanoparticles and surface-enhanced Raman spectroscopy (SERS) is described. To demonstrate the analytical capabilities of the new technique, Raman reporter (DTNB) that is coimmobilized with biospecific anti-protein A on gold nanoparticles (AuNP). Anti-protein A-AuNP-DTNB, which combing both electromagnetic field and chemical enhancement, was used to exploits the SERS-derived signal. A dynamic range of 2-3 orders of magnitude and 1-10 pg/mL of detection limitation of protein A were achieved. The results indicated this new technique could be used in clinical diagnostic applications with fast, high sensitivity and high-throughput screening of antibodies.
  • Keywords
    bio-optics; biomedical measurement; biosensors; gold; molecular biophysics; nanobiotechnology; nanoparticles; optical sensors; proteins; surface enhanced Raman scattering; SERS-derived signal; antibodies; biospecific antiprotein A; chemical enhancement; clinical diagnostic applications; electromagnetic field enhancement; functionalized bionanoparticles; gold nanoparticles; high-throughput screening; immunoassay system; immunosensing; surface-enhanced Raman scattering; Biomedical engineering; Glass; Gold; Immune system; Nanoparticles; Proteins; Raman scattering; Rough surfaces; Spectroscopy; Surface roughness; Surface-Enhanced Raman Spectroscopy (SERS); antibody; mercaptobenzoic; molecular probe; old nanoparticles; protein A;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068714
  • Filename
    5068714