DocumentCode
1960225
Title
Failure analysis of adhesive joining in electronics
Author
Povolotskaya, Evgenia ; Mach, Pavel
Author_Institution
Dept. of Electrotechnol., Czech Tech. Univ., Prague, Czech Republic
fYear
2011
fDate
11-15 May 2011
Firstpage
247
Lastpage
252
Abstract
The article focuses on formulation of appropriate risk estimation methods and procedures that enable involving to production process in electronics area. Two methods for risk assessment have been chosen with regard to the specifics of conductive joining based on electrically conductive adhesives. Typical features and failures of the process were identified. Failure mode and effect analysis (FMEA) method was implemented to adhesive joints. Actions for optimization of adhesive joining process are proposed.
Keywords
adhesive bonding; conductive adhesives; electronics industry; failure analysis; adhesive joining process; adhesive joint; conductive joining; effect analysis method; electrically conductive adhesives; electronics; failure analysis; failure mode; production process; risk assessment; risk estimation method; Conductive adhesives; Joints; Process control; Risk management; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location
Tratanska Lomnica
ISSN
2161-2528
Print_ISBN
978-1-4577-2111-3
Type
conf
DOI
10.1109/ISSE.2011.6053867
Filename
6053867
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