Failure analysis of adhesive joining in electronics

The article focuses on formulation of appropriate risk estimation methods and procedures that enable involving to production process in electronics area. Two methods for risk assessment have been chosen with regard to the specifics of conductive joining based on electrically conductive adhesives. Typical features and failures of the process were identified. Failure mode and effect analysis (FMEA) method was implemented to adhesive joints. Actions for optimization of adhesive joining process are proposed.