• DocumentCode
    1960470
  • Title

    Model reduction of variable-geometry interconnects using variational spectrally-weighted balanced truncation

  • Author

    Heydari, P. ; Pedram, M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA
  • fYear
    2001
  • fDate
    4-8 Nov. 2001
  • Firstpage
    586
  • Lastpage
    591
  • Abstract
    This paper presents a spectrally-weighted balanced truncation technique for RLC interconnects, a technique needed when the interconnect circuit parameters change as a result of variations in the manufacturing process. The salient features of this algorithm are the inclusion of parameter variations in the RLC interconnect, the guaranteed stability of the reduced transfer function, and the availability of provable frequency-weighted error bounds for the reduced-order system. This paper shows that the balanced truncation technique is an effective model-order reduction technique when variations in the circuit parameters are taken into consideration. Experimental results show that the new variational spectrally-weighted balanced truncation attains, on average, 20% more accuracy than the variational Krylov-subspace-based model-order reduction techniques while the run-time is also, on average, 5% faster.
  • Keywords
    integrated circuit interconnections; integrated circuit modelling; network parameters; reduced order systems; transfer functions; variational techniques; circuit parameters; frequency-weighted error bounds; manufacturing process; model-order reduction; transfer function; variable-geometry RLC interconnect; variational spectrally-weighted balanced truncation algorithm; Computer aided manufacturing; Controllability; Equations; Frequency; Integrated circuit interconnections; Observability; RLC circuits; Reduced order systems; Transfer functions; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-7247-6
  • Type

    conf

  • DOI
    10.1109/ICCAD.2001.968716
  • Filename
    968716