DocumentCode
1960538
Title
Modeling of microelectronic structures and packages using ANSYS software
Author
Psota, Boleslav ; Szendiuch, Ivan
Author_Institution
Dept. of Microelectron., FEEC BUT, Brno, Czech Republic
fYear
2011
fDate
11-15 May 2011
Firstpage
354
Lastpage
357
Abstract
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Keywords
electronic design automation; electronics packaging; finite element analysis; ANSYS software; BGA structures modeling; FEA method; electronic component; mechanical stress; microelectronic structures; packages; Biological system modeling; Computational modeling; Finite element methods; Lead; Mathematical model; Microelectronics; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location
Tratanska Lomnica
ISSN
2161-2528
Print_ISBN
978-1-4577-2111-3
Type
conf
DOI
10.1109/ISSE.2011.6053887
Filename
6053887
Link To Document