Title :
Modeling of microelectronic structures and packages using ANSYS software
Author :
Psota, Boleslav ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., FEEC BUT, Brno, Czech Republic
Abstract :
This paper informing about the modeling of BGA structures using ANSYS software. The FEA method is cleared up, but the main emphasis lays on mechanical stress issues. As example is shown the comparison of three different solders and described their usage for electronic components.
Keywords :
electronic design automation; electronics packaging; finite element analysis; ANSYS software; BGA structures modeling; FEA method; electronic component; mechanical stress; microelectronic structures; packages; Biological system modeling; Computational modeling; Finite element methods; Lead; Mathematical model; Microelectronics; Stress;
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
Print_ISBN :
978-1-4577-2111-3
DOI :
10.1109/ISSE.2011.6053887
