• DocumentCode
    1960859
  • Title

    Challenges in power-ground integrity

  • Author

    Shen Lin ; Chang, N.

  • Author_Institution
    Apache Design Solutions Inc., Palo Alto, CA, USA
  • fYear
    2001
  • fDate
    4-8 Nov. 2001
  • Firstpage
    651
  • Lastpage
    654
  • Abstract
    With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with increasingly higher speed are being integrated at an increasingly higher density. This trend causes correspondingly larger voltage fluctuations in the on-chip power distribution network due to IR-drop, L di/dt noise, or LC resonance. Therefore, power-ground integrity becomes a serious challenge in designing future high-performance circuits. In this paper, we introduce power-ground integrity, addressing its importance, verification methodology, and problem solution.
  • Keywords
    VLSI; circuit CAD; integrated circuit design; integrated circuit noise; power supply circuits; EDA; IR-drop; L di/dt noise; LC resonance; VLSI; density; design technologies; on-chip power distribution network; power-ground integrity; semiconductor manufacturing; speed; verification methodology; voltage fluctuations; Electronic design automation and methodology; Integrated circuit manufacture; Integrated circuit technology; Network-on-a-chip; Power systems; Resonance; Semiconductor device manufacture; Semiconductor device noise; Very large scale integration; Voltage fluctuations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-7247-6
  • Type

    conf

  • DOI
    10.1109/ICCAD.2001.968730
  • Filename
    968730