Title :
Challenges in power-ground integrity
Author :
Shen Lin ; Chang, N.
Author_Institution :
Apache Design Solutions Inc., Palo Alto, CA, USA
Abstract :
With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with increasingly higher speed are being integrated at an increasingly higher density. This trend causes correspondingly larger voltage fluctuations in the on-chip power distribution network due to IR-drop, L di/dt noise, or LC resonance. Therefore, power-ground integrity becomes a serious challenge in designing future high-performance circuits. In this paper, we introduce power-ground integrity, addressing its importance, verification methodology, and problem solution.
Keywords :
VLSI; circuit CAD; integrated circuit design; integrated circuit noise; power supply circuits; EDA; IR-drop; L di/dt noise; LC resonance; VLSI; density; design technologies; on-chip power distribution network; power-ground integrity; semiconductor manufacturing; speed; verification methodology; voltage fluctuations; Electronic design automation and methodology; Integrated circuit manufacture; Integrated circuit technology; Network-on-a-chip; Power systems; Resonance; Semiconductor device manufacture; Semiconductor device noise; Very large scale integration; Voltage fluctuations;
Conference_Titel :
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7247-6
DOI :
10.1109/ICCAD.2001.968730