DocumentCode
1960859
Title
Challenges in power-ground integrity
Author
Shen Lin ; Chang, N.
Author_Institution
Apache Design Solutions Inc., Palo Alto, CA, USA
fYear
2001
fDate
4-8 Nov. 2001
Firstpage
651
Lastpage
654
Abstract
With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with increasingly higher speed are being integrated at an increasingly higher density. This trend causes correspondingly larger voltage fluctuations in the on-chip power distribution network due to IR-drop, L di/dt noise, or LC resonance. Therefore, power-ground integrity becomes a serious challenge in designing future high-performance circuits. In this paper, we introduce power-ground integrity, addressing its importance, verification methodology, and problem solution.
Keywords
VLSI; circuit CAD; integrated circuit design; integrated circuit noise; power supply circuits; EDA; IR-drop; L di/dt noise; LC resonance; VLSI; density; design technologies; on-chip power distribution network; power-ground integrity; semiconductor manufacturing; speed; verification methodology; voltage fluctuations; Electronic design automation and methodology; Integrated circuit manufacture; Integrated circuit technology; Network-on-a-chip; Power systems; Resonance; Semiconductor device manufacture; Semiconductor device noise; Very large scale integration; Voltage fluctuations;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
ISSN
1092-3152
Print_ISBN
0-7803-7247-6
Type
conf
DOI
10.1109/ICCAD.2001.968730
Filename
968730
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