DocumentCode :
1960859
Title :
Challenges in power-ground integrity
Author :
Shen Lin ; Chang, N.
Author_Institution :
Apache Design Solutions Inc., Palo Alto, CA, USA
fYear :
2001
fDate :
4-8 Nov. 2001
Firstpage :
651
Lastpage :
654
Abstract :
With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with increasingly higher speed are being integrated at an increasingly higher density. This trend causes correspondingly larger voltage fluctuations in the on-chip power distribution network due to IR-drop, L di/dt noise, or LC resonance. Therefore, power-ground integrity becomes a serious challenge in designing future high-performance circuits. In this paper, we introduce power-ground integrity, addressing its importance, verification methodology, and problem solution.
Keywords :
VLSI; circuit CAD; integrated circuit design; integrated circuit noise; power supply circuits; EDA; IR-drop; L di/dt noise; LC resonance; VLSI; density; design technologies; on-chip power distribution network; power-ground integrity; semiconductor manufacturing; speed; verification methodology; voltage fluctuations; Electronic design automation and methodology; Integrated circuit manufacture; Integrated circuit technology; Network-on-a-chip; Power systems; Resonance; Semiconductor device manufacture; Semiconductor device noise; Very large scale integration; Voltage fluctuations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Aided Design, 2001. ICCAD 2001. IEEE/ACM International Conference on
Conference_Location :
San Jose, CA, USA
ISSN :
1092-3152
Print_ISBN :
0-7803-7247-6
Type :
conf
DOI :
10.1109/ICCAD.2001.968730
Filename :
968730
Link To Document :
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