Title :
Monolithic integration of silica-based AWG filter and germanium photodiodes for one-chip WDM receiver
Author :
Nishi, Hidetaka ; Tsuchizawa, Tai ; Kou, Rai ; Shinojima, Hiroyuki ; Yamada, Koji ; Yamada, Takashi ; Kimura, Hideaki ; Ishikawa, Yasuhiko ; Wada, Kazumi ; Mutoh, Shin-ichiro
Author_Institution :
NTT Microsyst. Integration Labs., NTT Corp., Atsugi, Japan
Abstract :
Using low-temperature plasma-enhanced chemical vapor deposition, a silica-based arrayed-waveguide grating (AWG) filter has been monolithically integrated with germanium photodiodes on a silicon-based photonic platform. All the outputs of a 16-channel AWG with 200-GHz spacing have been equipped with germanium photodiodes. All wavelength channels of the integrated device were confirmed to function as a wavelength-division-demultiplexing receiver for 1.25-Gbps PRBS signals. In addition, we have successfully mounted multi-channel transimpedance amplifiers and limiting amplifiers on the integrated photonic device using flip-chip bonding technology.
Keywords :
arrayed waveguide gratings; bonding processes; elemental semiconductors; flip-chip devices; germanium; integrated optics; optical filters; optical receivers; photodiodes; plasma CVD; silicon; wavelength division multiplexing; Ge; Si; arrayed waveguide gratings; bit rate 1.25 Gbit/s; flip-chip bonding technology; frequency 200 GHz; germanium photodiodes; integrated photonic device; low-temperature plasma-enhanced chemical vapor deposition; monolithic integration; multi-channel transimpedance amplifiers; one-chip WDM receiver; silica-based AWG filter; wavelength division multiplexing; Arrayed waveguide gratings; Photonics; Propagation losses; Silicon; Wavelength division multiplexing; Wires;
Conference_Titel :
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2012 and the National Fiber Optic Engineers Conference
Conference_Location :
Los Angeles, CA
Print_ISBN :
978-1-4673-0262-3
